www.alink.com.tw SMT FINGER PRODUCT Many different shape of SMT metal parts : Manufacturing technology - Stamping machine - Multi-Slide machine Designing & Testing - Finite element analysis - Automatic Compression Test - 2D / 3D cad software support Alink Precision Co., td No.1.ane 389,uacheng Rd.,Sinjhuang City,Taipei County 242 Taiwan Tel :886 2 8521 3168 Fax :886 2 8521 8579 ebsite : www.alink.com.tw e mail : jackl@alink.com.tw
SMT Finger ith the rapid of electronic technology go up,high frequency will let EMI and ESD become a big problem,especially in handheld equipment will let the problem get worse,and the solution will get more difficult,for that reason,part of designer use foam gasket for EMI solution,but it will be more difficult if the product is too small to assemble quickly,smt finger is a good method to match the requirement,its good reliability and automatically position will let production smooth and good quality. Alink has developed a lot of SMT finger for designer and have a design team for customized project,2d & 3D drawing is available,with our forming technology by spring former,will reduce its tooling cost and increase its life cycle than metal stamping technology,that is the reason why we insist produce by spring former. Application SMT finger is used by different product in different function : Grounding Contact Signal Contact Mechanical Application Power Contact Jump Bridge Contact Alink Precision Co., td No.1.ane 389,uacheng Rd.,Sinjhuang City,Taipei County 242 Taiwan Tel :886 2 8521 3168 Fax :886 2 8521 8579 ebsite : www.alink.com.tw e mail : jackl@alink.com.tw ink to the success with Alink
SMT finger structure Structure Note SMT finger cross section drawing Electroplated(outside) : Au electroplated Tin electroplated Electroplated(inner) : Ni electroplated Raw material : Beryllium Copper Stainless Steel TiCu Phosphor Bronze customer assigned Au plated (outside) : can resist bad circumstance and good electric conductivity. Tin plated (outside) : good solidarity,but easy to oxidize in air,especially in high humidity. Ni plated (inner) : good stand for oxidization good adhesion for electroplated layer. good stand for friction. Raw material : beryllium copper is the best material good thermal conductivity good electric conductivity easy to be forming Alink Precision Co., td No.1.ane 389,uacheng Rd.,Sinjhuang City,Taipei County 242 Taiwan Tel :886 2 8521 3168 Fax :886 2 8521 8579 ebsite : www.alink.com.tw e mail : jackl@alink.com.tw ink to the success with Alink
SMT finger design guide Compression height and range : In general,we will recommend about 30%~40% of total height for SMT finger compression or at least 0.25mm compression range to be a good electrical conductivity. PAD recommend dimension : To match SMT finger for PCB lay out,we will give our customer a better PAD size to prevent from a bad junction between part and PCB. SMT finger action area : To keep from touching other component when SMT finger is acting,we will give our customer a safe area. Example : X Y A X * Y is the recommended pad size and A * B is action area B Part number definition A B C1 C2 D1 D2 E1 E2 E3 F SMT Finger idness ength eight shape (mm) (mm) (mm) Electroplated G: Au S: Tin Raw mater B: BeCu S: Stainless Steel T: TiCu P: Phosphor Bronze Alink Precision Co., td No.1.ane 389,uacheng Rd.,Sinjhuang City,Taipei County 242 Taiwan Tel :886 2 8521 3168 Fax :886 2 8521 8579 ebsite : www.alink.com.tw e mail : jackl@alink.com.tw ink to the success with Alink
SMT finger application * Grounding contact * Singal connector * Battery contact * Mechanical application A major fuction for SMT finger is common grounding,often applicated by notebook,cellular phone,digital camera,projector.etc. another application also usable in different kind of product,like as bellows : Application Photo for different function Grounding Contact Grounding Contact Signal Connector orozontal Contact Major function of SMT finger,usually be designed in case to PCB,PCB to PCB for common grounding effect. Vertical Contact Usually design in PCB to side of case for common grounding effect,like projector,printer,settop box...etc. Antenna spring connector To be a signal connector between external antenna and PCB for a good signal conduction. Signal Contact Spacer Contact Clip for Cable & ire Embedded antenna connector To be a signal connector between embedded antenna and PCB for a good signal conduction conduction. Clip for Shielding Cover Spacer contact To weld spacer connector on the copper pad to enhance the strength of standing for friction,especially in cellular phone speaker junction..etc. Cable fix and put to order To fix the cable and grounding function East to repair &assembly To be a clip for shielding cover will save the space & frame cost,also be flexible to different shape shielding cover Alink Precision Co., td No.1.ane 389,uacheng Rd.,Sinjhuang City,Taipei County 242 Taiwan Tel :886 2 8521 3168 Fax :886 2 8521 8579 ebsite : www.alink.com.tw e mail : jackl@alink.com.tw
GROUNDING & SIGNA & POER CONTACT FUNCTION PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG0820010B BeCu 0.08 Ni/Au 3,000PCS /7 REE (mm) 0.80 (mm) 2.00 (mm) 1.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG0820013B BeCu 0.08 Ni/Au 2,500PCS/7 REE (mm) 0.80 (mm) 2.00 (mm) 1.30 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK G1725014B BeCu 0.08 Ni/Au 4,000PCS/13 REE (mm) 1.70 (mm) 2.50 (mm) 1.40 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG1527015B BeCu 0.08 Ni/Au 3,500/13 REE (mm) 1.50 (mm) 2.70 (mm) 1.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2032015B BeCu 0.08 Ni/Au 2,500PCS/REE (mm) 2.00 (mm) 3.20 (mm) 1.50
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG1228017B BeCu 0.12 Ni/Au 3,800PCS /13 REE (mm) 1.20 (mm) 2.80 (mm) 1.70 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG0846018B BeCu 0.08 Ni/Au 2,000PCS/7 REE (mm) 0.80 (mm) 4.60 (mm) 1.80 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG1527020T TiCu 0.10 Ni/Au 3,500PCS/13 REE (mm) 1.50 (mm) 2.70 (mm) 2.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2038020B BeCu 0.08 Ni/Au 2,000PCS/7 REE (mm) 2.00 (mm) 3.80 (mm) 2.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2040021B BeCu 0.08 Ni/Au 3,000PCS/13 REE (mm) 2.00 (mm) 4.00 (mm) 2.10
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK ZG1835025B BeCu 0.08 Ni/Au 3,000PCS/13 REE (mm) 1.80 (mm) 3.50 (mm) 2.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G2030025B BeCu 0.08 Ni/Au 5,500PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 2.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 5G2030025B BeCu 0.08 Ni/Au 5,500PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 2.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2028028S SUS 0.08 Ni/Au 2,500PCS/13 REE (mm) 2.00 (mm) 2.88 (mm) 2.80 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G2030030B BeCu 0.10 Ni/Au 2,500PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 3.00
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 5G2030031B BeCu 0.08 Ni/Au 2,300PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 3.10 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK SG2030031B BeCu 0.08 Ni/Au 2,300PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 3.10 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK ZG1237032B BeCu 0.10 Ni/Au 2,500PCS/13 REE (mm) 1.20 (mm) 3.70 (mm) 3.20 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G2030035B BeCu 0.08 Ni/Au 2,000PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 3.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2543035B BeCu 0.10 Ni/Au 2,000PCS/13 REE (mm) 2.50 (mm) 4.30 (mm) 3.50
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2545035B1 BeCu 0.10 Ni/Au 2,000PCS/13 REE (mm) 2.50 (mm) 4.50 (mm) 3.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK SG2030036B BeCu 0.10 Ni/Au 2,000PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 3.60 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 8G2040037B BeCu 0.10 Ni/Au 2,000PCS/13 REE (mm) 2.00 (mm) 4.00 (mm) 3.70 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2030040B BeCu 0.08 Ni/Au 2,000PCS/13 REE (mm) 2.00 (mm) 3.00 (mm) 4.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2530040B BeCu 008 Ni/Au 2,000PCS/13 REE (mm) 2.50 (mm) 3.00 (mm) 4.00
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK XG2535040B BeCu 0.08 Ni/Au 2,000PCS/13 REE (mm) 2.50 (mm) 3.50 (mm) 4.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK ZG3050040B BeCu 0.08 Ni/Au 2,000PCS /13 REE (mm) 3.00 (mm) 5.00 (mm) 4.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 5G2540041B BeCu 0.08 Ni/Au 2,000PCS/13 REE (mm) 2.50 (mm) 4.00 (mm) 4.10 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 5G2035042S SUS 0.10 Ni/Au 2,500PCS/13 REE (mm) 2.00 (mm) 3.50 (mm) 4.20 ART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 8G2045045B BeCu 0.10 Ni/Au 3,500PCS/13 REE (mm) 2.00 (mm) 4.50 (mm) 4.50
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2548045B BeCu 0.15 Ni/Au 1,500PCS/13 REE (mm) 2.50 (mm) 4.80 (mm) 4.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2045048B BeCu 0.10 Ni/Au 1,500PCS/13 REE (mm) 2.00 (mm) 4.50 (mm) 4.80 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2545048B BeCu 0.10 Ni/Au 1,500PCS/13 REE (mm) 2.50 (mm) 4.50 (mm) 4.80 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 7G2540050B BeCu 0.10 Ni/Au 1,500PCS/13 REE (mm) 2.50 (mm) 4.00 (mm) 5.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2058050B BeCu 0.15 Ni/Au 1,500PCS/13 REE (mm) 2.00 (mm) 5.80 (mm) 5.00
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 8G3040051B BeCu 0.08 Ni/Au 1,500PCS/13 REE (mm) 3.00 (mm) 4.00 (mm) 5.10 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2040053B BeCu 0.08 Ni/Au 1,500PCS/13 REE (mm) 2.00 (mm) 4.00 (mm) 5.30 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK CG2047057B BeCu 0.10 Ni/Au 1,500PCS/13 REE (mm) 2.00 (mm) 4.70 (mm) 5.70 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G2038062B BeCu 0.10 Ni/Au 1,400PCS/13 REE (mm) 2.00 (mm) 3.80 (mm) 6.20 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 8G2570062B BeCu 0.15 Ni/Au 1,200PCS/13 REE (mm) 2.50 (mm) 7.00 (mm) 6.20
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G2045070B BeCu 0.10 Ni/Au 1,000PCS/13 REE (mm) 2.00 (mm) 4.50 (mm) 7.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G2548070B BeCu 0.10 Ni/Au 1,000PCS /13 REE (mm) 2.50 (mm) 4.80 (mm) 7.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 8G2570075B BeCu 0.15 Ni/Au 700PCS/13 REE (mm) 2.50 (mm) 7.00 (mm) 7.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G2570090B BeCu 0.10 Ni/Au 500PCS/13 REE (mm) 2.50 (mm) 7.00 (mm) 9.00 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 3G3060100B BeCu 0.10 Ni/Au 500PCS/13 REE (mm) 3.00 (mm) 6.00 (mm) 10.0
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 8G2570100B BeCu 0.12 Ni/Au 500PCS/13 REE (mm) 2.50 (mm) 7.00 (mm) 10.0 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK 8G2590130B BeCu 0.15 Ni/Au 300PCS /13 REE (mm) 2.50 (mm) 9.00 (mm) 13.0 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK (mm) (mm) (mm) PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK (mm) (mm) (mm) PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK (mm) (mm) (mm)
SPACER CONTACT FUNCTION PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PG1019001P POSPER BRONZE 0.10 Ni/Au 8,000PCS/7 REE (mm) 1.00 (mm) 1.90 (mm) 0.10 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PG1020001B BeCu 0.10 Ni/Au 9,000PCS/7 REE (mm) 1.00 (mm) 2.00 (mm) 0.10 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PG1838001B BeCu 0.10 Ni/Au 2,000PCS/7 REE (mm) 1.80 (mm) 3.80 (mm) 0.10 ART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PG1625002B BeCu 0.20 Ni/Au 4,000PCS/7 REE (mm) 1.60 (mm) 2.50 (mm) 0.20 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PG3232002B BeCu 0.20 Ni/Au 2,000PCS/7 REE Φ(O.D.) Φ (mm) 3.20 (mm) 0.20
PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PG3038005B BeCu 0.50 Ni/Au 2,000PCS/7 REE (mm) 3.00 (mm) 3.80 (mm) 0.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK OG2554027P POSPER BRONZE 0.20 Ni/Au 2,600PCS/13 REE (mm) 2.50 (mm) 5.40 (mm) 2.70 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PG2176005P POSPER BRONZE 0.50 Ni/Au 3,000PCS/7 REE (mm) 2.10 (mm) 7.60 (mm) 0.50 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK (mm) (mm) (mm) PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK (mm) (mm) (mm)
CIP FOR SIEDING COVER PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK SCS0865128S SUS 0.15 Ni/Sn 10,000PCS /13 REE D (mm) 0.80 (mm) 6.50 (mm) 1.28 D (mm) 0.15 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK SCS0865012S SUS 0.15 Ni/Sn 10,000PCS /13 REE D (mm) 0.80 (mm) 6.50 (mm) 1.20 D (mm) 0.09 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK
CIP FOR RF CABE & IRE PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK DS1445014S SUS 0.15 Ni/Sn 10,000PCS /13 REE D (mm) 1.38 (mm) 4.50 (mm) 1.40 D (mm) 0.78 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK DS1752022B BeCu 0.10 Ni/Sn 3,000PCS/13 REE D (mm) 1.73 (mm) 5.25 (mm) 2.23 D (mm) 0.46 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK DS1355015S SUS 0.10 Ni/Sn 4,000PCS/13 REE D (mm) 1.30 (mm) 5.45 (mm) 1.5 D (mm) 0.60 PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK PART NUMBER MATERIA TICKNESS(mm) EECTROPATED SMT PACKING REMARK